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Bare Die Tray with a Capacity of 11x13=143PCS Suitable for the Semiconductor Industry

Name: Bare Die Tray with a Capacity of 11x13=143PCS Suitable for the Semiconductor Industry
Brand: Shenzhen Hiner Technology Co.,LTD
SKU: HN25064
Price: 0.35 USD
Availability: InStock

Nom De Marque:	Hiner-pack
Numéro De Modèle:	HN25064
Nombre De Pièces:	1000 Pcs
Prix:	$0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities）
Conditions De Paiement:	T/T
Capacité à Fournir:	4000PCS~5000PCS/per Day

Informations détaillées

Description du produit

Informations détaillées

Lieu d'origine:

Shenzhen, Chine

Certification:

ISO 9001 ROHS SGS

Facultatif:

Couvercle et pinceau

Méthode de moulage:

Moulage par injection

Propriété:

DSE, non-DSE

Warpage:

à hauteur < 0,3 mm

Forme:

Rectangulaire

Logo personnalisé:

Disponible

Résistant à la chaleur:

Oui

Packaging Details:

It Depends On The QTY Of Order And Size Of Product

Supply Ability:

4000PCS~5000PCS/per Day

Mettre en évidence:

Bare Die Tray 11x13 capacity

Semiconductor industry die tray

143PCS bare die storage

Description du produit

Product Description:

As a leading provider in the semiconductor packaging and testing industry, our firm has innovatively crafted the Die Carrier Series, tailored to fulfill the exacting demands of advanced semiconductor manufacturing. Aligning with the worldwide Semiconductor industry towards miniaturization and heightened integration, we have thoroughly comprehended the rigorous market specifications for chip packaging solutions, resulting in a comprehensive portfolio encompassing chips of all sizes. This offering boasts permanent antistatic properties, dust resistance, and robust durability, alongside unparalleled dimensional precision.

Features:

Product Name: Bare Die Trays
Customizable Logo: Available
Molding Method: Injection Moulding
Heat Resistant: Yes
Stackable: Yes
Esd Protection: Yes

Applications:

♦Temporary Storage in Semiconductor Production:

During the manufacturing and packaging of semiconductor chips, it can effectively protect the chips from physical damage and electrostatic discharge, ensuring the integrity and reliability of the chips throughout the manufacturing and packaging process.

♦Chip Transportation and Distribution:

As a professional packaging container, the bare die tray can effectively protect the chips during transportation, reducing the risk of chip failure due to physical damage or electrostatic discharge.

Customization:

Brand Name: Hiner-pack

Model Number: HN25064

Place Of Origin: Shenzhen, China

Packaging Details: It Depends On The QTY Of Order And Size Of Product

Molding Method: Injection Moulding

Heat Resistant: Yes

Outline Line Size	101.6101.66mm	Brand	Hiner-pack
Model	HN 25064	Package Type	FBGA IC
Cavity Size	5.74.22.25mm	Matrix QTY	11*13=142PCS
Material	ABS,PC	Flatness	MAX 0.3mm
Color	Black	Service	Accept OEM,ODM
Resistance	1.0x10e4-1.0x10e11Ω	Certificate	ROHS

Packing and Shipping:

♠Product Packaging:

The Bare Die Trays are carefully placed in individual compartments within a sturdy cardboard box to ensure safe transportation.

♠Shipping:

Once packed, the Bare Die Trays are sealed and labeled for shipping. They are then securely placed in a shipping box along with any necessary packing materials to prevent damage during transit.

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Bare Die Tray with a Capacity of 11x13=143PCS Suitable for the Semiconductor Industry

Bare Die Tray with a Capacity of 11x13=143PCS Suitable for the Semiconductor Industry

Bare Die Tray 11x13 capacity

Semiconductor industry die tray

143PCS bare die storage

Product Description:

Features:

Applications:

Customization:

Packing and Shipping:

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