Display Waffle Pack série de produits IC Chip Tray Pour les dispositifs IC

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Display Waffle Pack série de produits IC Chip Tray Pour les dispositifs IC

Essai d'assemblage de l'échantillon

December 28, 2021

Category Connection: IC Chip Tray

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Les étiquettes:

#JEDEC IC Chip Tray #Plateaux de rf JEDEC Matrix #Plateaux d'IC JEDEC Matrix

Brief: Discover our OEM Black Anti-Static Bare Die Trays, designed for semiconductor production lines. These 2-inch non-toxic, RoHS-standard trays are stackable, reusable, and automation-ready, perfect for high-temperature processes like solder reflow and die attach curing. Ideal for CSPs, bare die, and passive devices.

Related Product Features:

Stackable and reusable design for efficient semiconductor production workflows.
Automation-ready, compatible with pick-and-place arms and tray shuttling systems.
High-temperature resistance for solder reflow, die attach curing, and burn-in testing.
Precision-molded pocket layout for flat or semi-flat components like CSPs and bare die.
Constructed from advanced bakeable plastic compounds for structural integrity.
2x2 inch footprint with 20*25 matrix layout, holding 500 pieces per tray.
Anti-static properties with resistance range of 1.0x10e4-1.0x10e11Ω.
RoHS and SGS certified, ensuring compliance with international standards.

FAQ:

Can you do OEM and customized design IC trays?

Yes, we have strong mold manufacturing and product design capabilities, with extensive experience in mass production of various IC trays.
How long is your delivery time?

Typically 5-8 working days, depending on the order quantity and specific requirements.
Do you provide samples? Is it free or extra?

Yes, we offer samples which may be free or charged based on product value, with shipping costs typically collected or as agreed.
What kind of Incoterms can you support?

We support various Incoterms including Ex works, FOB, CNF, CIF, CFR, DDU, DAP, and others as agreed upon.