Plateau de composants MPPO ESD noir de 7,62 mm d'épaisseur pour les dispositifs IC BGA

Exemple d'affichage
June 12, 2024
Video Description:
Discover the Black MPPO ESD Component Tray, 7.62mm thick, designed for BGA IC Devices. Secure, stackable, and fully traceable, this JEDEC tray streamlines logistics in fast-paced manufacturing environments. Ideal for various IC packaging solutions.