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Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging

Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging

Nom De Marque: Hiner-pack
Numéro De Modèle: HN25004
Nombre De Pièces: 500 pièces
Prix: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Conditions De Paiement: T/T
Capacité à Fournir: 2000 pièces/jour
Informations détaillées
Lieu d'origine:
Chine
Certification:
ROHS, ISO
Tray Weight:
Varie, généralement jusqu'à 500 grammes par cavité
Couleur:
Noir
Assurance qualité:
Garantie de livraison, qualité fiable
Taille de la cavité:
322,6 × 135,9 × 7,62 mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Type de moule:
Injection
Réutilisable:
Oui
Forme du plateau:
Rectangulaire
Classe propre:
Nettoyage général et ultrasonique
Type de circuit intégré:
Le nombre de points de contrôle est déterminé en fonction de l'échantillon.
Niveau d'emballage:
Forfait Transport
Platitude:
Moins de 0,76 mm
Capacité:
7x23 = 161 pièces
Détails d'emballage:
carton, palette
Capacité d'approvisionnement:
2000 pièces/jour
Description du produit
Durable JEDEC IC Trays for Dust-Free Semiconductor Wafer Packaging
Provide stable protection for delicate wafers throughout packaging processes. Maintain clean working conditions with effective dust control. Built with strong structure to support long-term industrial use. Searching for dependable tray solutions for semiconductor production?

Fit high-standard manufacturing environments and automated production lines. Ensure stable performance during wafer handling and transfer processes. Adapt to various semiconductor packaging procedures smoothly.

Support safe storage and transportation of wafers. Accept customized sizes and structures to meet different production needs. Provide tailored solutions for diverse semiconductor packaging requirements.
Key Features/ Benefits 
  • Strong durable structure
  • Stable wafer protection
  • Safeguard wafer packaging processes
  • Comply with JEDEC standards
  • Flexible customization
Specifications
BrandHiner-pack
ModelHN25004
Material MPPO
Package TypeJEDEC
ColorBlack
Resistance1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size322.6×135.9×7.62 mm
Cavity Size13×7.5×7.62 mm
Matrix QTY7x23=161 PCS
WarpageMAX 0.76mm
ServiceAccept OEM, ODM
Custom Pocket OptionsAvailable
Applications
Widely used in semiconductor wafer packaging, chip testing, die sorting and device manufacturing. Suitable for cleanroom production, automated assembly lines and high-precision processing workshops. Perfectly match various wafer level packaging processes and ensure stable performance in strict production environments.

Also applied to wafer storage, factory logistics, production turnover and sample delivery. Meet requirements of semiconductor packaging plants, testing centers and electronic component manufacturers. Support safe and efficient operation of the whole semiconductor production and supply chain.
Customized Services
Provide professional customized services for JEDEC IC trays according to customer needs. Support personalized design of cavity size, arrangement and material. Create exclusive tray structures for different wafers and packaging processes. Offer one-stop tailored solutions to improve production efficiency and meet special application requirements in semiconductor manufacturing.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers