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Cleanroom-Grade Waffle Pack Chip Trays for IC Handling Contamination Control

Cleanroom-Grade Waffle Pack Chip Trays for IC Handling Contamination Control

Nom De Marque: Hiner-pack
Numéro De Modèle: HN24132
Nombre De Pièces: 500 pièces
Prix: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Conditions De Paiement: T/T
Capacité à Fournir: 2000 pièces/jour
Informations détaillées
Lieu d'origine:
Chine
Certification:
ROHS, ISO
Tray Weight:
Varie, généralement jusqu'à 500 grammes par cavité
Couleur:
Généralement noir ou gris foncé pour la protection ESD
Assurance qualité:
Garantie de livraison, qualité fiable
Taille de la cavité:
5,0x3,35x1,20 mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Type de moisissure:
Injection
Réutilisable:
Oui
Forme du plateau:
Rectangulaire
Classe propre:
Nettoyage général et ultrasonique
Type de circuit intégré:
Le nombre de points de contrôle est déterminé en fonction de l'échantillon.
Niveau d'emballage:
Forfait Transport
Déformation:
Déformation MAX 0,3 mm
Capacité:
9x7 = 63 pièces
Détails d'emballage:
carton, palette
Capacité d'approvisionnement:
2000 pièces/jour
Description du produit
Cleanroom-Grade Waffle Pack Chip Trays for IC Handling Contamination Control

Cleanroom-Grade Waffle Pack Chip Trays meet strict cleanroom industry standards. Trays provide professional contamination control performance, and offer safe stable handling for delicate fine pitch IC chips.


Cleanroom-Grade Waffle Pack Chip Trays adopt reliable JEDEC standard structure. Trays effectively avoid dust and pollution damage, and well protect precision semiconductor chips in manufacturing processes.


Cleanroom-Grade Waffle Pack Chip Trays deliver stable reliable chip carrier performance. Trays fit daily IC packaging, storage and transport work perfectly, keeping sensitive chips clean and intact.

Key Features/ Benefits 
  • Support small batch production in the first batch.
  • Effective IC Contamination Control
  • Suitable for Delicate Fine Pitch ICs
  • More than 12 years of export experience.
  • Safe Stable Semiconductor Handling
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
BrandHiner-pack
ModelHN24132
MaterialMPPO
ColorBlack
Resistance1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size50.7×50.7×7.4 mm
Cavity Size5.0x3.35x1.20 mm
Matrix QTY9x7=63 PCS
WarpageMAX 0.2mm
ServiceAccept OEM, ODM
Custom Pocket OptionsAvailable
Applications
Cleanroom-Grade Waffle Pack Chip Trays provide full reliable IC protection during semiconductor manufacturing and transportation. Trays own excellent contamination control performance, and perfectly protect ESD-sensitive fine pitch chip devices.

Trays are widely used for fine pitch IC packaging (QFN, BGA, CSP), automated pick-and-place equipment, semiconductor inspection & testing work, as well as daily IC logistics and storage management.

Customized Services
Cleanroom-Grade Waffle Pack Chip Trays support fully customized cavity sizes and layout designs. Trays adopt cleanroom-grade dust-free anti-static material, with stable stacking structure to avoid contamination damage during transit.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers