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Heat-Proof Antistatic JEDEC Matrix Trays For IC Components With Injection Molding

Nom De Marque:	Hiner-pack
Numéro De Modèle:	HN24117
Nombre De Pièces:	500pcs
Prix:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Conditions De Paiement:	100% Prepayment
Capacité à Fournir:	2000PCS/Day

Informations détaillées

Description du produit

Informations détaillées

Lieu d'origine:

Shenzhen Chine

Certification:

RoHS、ISO

Service personnalisé:

Support Standard And Non-standard

Matrice:

4*7 = 28 pièces

Durable:

Oui

Matériel:

MPPO

Empilable:

Oui

Résistance de surface:

1.0x10E4~1.0x10E11Ω

Méthode de moulage:

Moulage par injection

Packaging Details:

70~100pcs/carton(According To The Customer Demand）

Supply Ability:

2000PCS/Day

Mettre en évidence:

Surface Resistance 1.0x10E4~1.0x10E11Ω JEDEC Matrix Trays

Matrix 8*18=144PCS JEDEC Trays

Durable IC Component Trays

Description du produit

Heat-Proof Antistatic JEDEC Matrix Trays For IC Components With Injection Molding

JEDEC (Joint Electronic Device Engineering Council - www.jedec.org) creates open standards for the microelectronics industry, ensuring product interoperability, benefiting the industry and ultimately consumers by reducing product development time and costs while increasing efficiency and productivity.

JEDEC trays all are the same size, with a standardized outline, and required features. Putting parts in a JEDEC tray ensures that your parts can be processed in industry-standard automation equipment like pick and place machines, inspection, laser marking, testing, and dispensing equipment. Commercially available JEDEC tray feeders can be easily added to custom process machines. When you use JEDEC trays, you get an instant benefit from decades of experience and access to an installed base and continuing supply of automation tools.

The maximum baking temperature is stamped into JEDEC trays. Exceeding the stated maximum baking temperature will cause the dimensions of the tray to alter; thus, potentially damaging the contents. The type of molding compound used during the tray's manufacture determines the tray's maximum temperature rating. Multiple compounds and/or powders are mixed together during the molding process to add specific features such as color, ESD properties, dimensional stability and maximum temperature ratings.

Features:

In general, JEDEC trays are custom designed and manufactured. Many of them are not only device specific but device manufacturer specific.
It's not uncommon for two component sources' parts to require different trays because of allowable variation in package sizing.
Off-the-shelf simply means a manufacturer has enough demand for a specific custom tray that they carry some inventory.
More common is open-tooled where a custom mold will be set up and run for any order but often with a minimum quantity and/or significant setup charges.

Technical Parameters:

Brand	Hiner-pack	Outline Line Size	322.6x135.9x7.62mm
Model	HN24117	Cavity Size	106.452.6mm
Material	MPPO	Matrix QTY	4*7=28PCS
Package Type	IC Component	Flatness	MAX 0.76mm
Color	Black	Service	Accept OEM, ODM
Resistance	1.0x10e4-1.0x10e11Ω	Certificate	RoHS, IOS

Applications:

Packaging: At their core, trays are simply containers. The JEDEC tray outline includes features for stacking, whereby each successive tray becomes the cover for the tray below.
Transportation & Storage: Parts loaded into stacked JEDEC trays are easy to store or transport, across the room or around the world. JEDEC trays also function as process "boats", transporting their contents through a variety of process tools and equipment.
Protection: JEDEC trays protect the parts they hold from mechanical damage. Most JEDEC trays are manufactured using materials that also provide electrical protection from electrostatic discharge (ESD) damage.

Les étiquettes:

Plateaux de JEDEC IC

Plateaux de JEDEC Matrix

IC Chip Tray

Plateaux faits sur commande de JEDEC

Paquet Chip Trays de gaufre

Plateau de composants électroniques

Nu meurent les plateaux

Anti plateaux statiques

Agrafes de couvercles de paquet de gaufre

Boîte collante de gel

Carton d'expédition de gaufrette

Cassette à plaquettes métalliques

Plateaux de JEDEC IC

Plateaux de JEDEC Matrix

IC Chip Tray

Plateaux faits sur commande de JEDEC

Paquet Chip Trays de gaufre

Plateau de composants électroniques

Nu meurent les plateaux

Anti plateaux statiques

Agrafes de couvercles de paquet de gaufre

Boîte collante de gel

Carton d'expédition de gaufrette

Cassette à plaquettes métalliques

Heat-Proof Antistatic JEDEC Matrix Trays For IC Components With Injection Molding

Heat-Proof Antistatic JEDEC Matrix Trays For IC Components With Injection Molding

Surface Resistance 1.0x10E4~1.0x10E11Ω JEDEC Matrix Trays

Matrix 8*18=144PCS JEDEC Trays

Durable IC Component Trays

Plateaux d'ESD JEDEC Matrix

Plateaux de GV JEDEC Matrix

Plateau de GV JEDEC

Plateaux de matrice ESD réutilisés Plateau d'expédition JEDEC IC pour appareil optique

Plateaux noirs en plastique de GV ESD JEDEC Matrix pour les produits électroniques

Module de carte PCB empaquetant la haute température des plateaux 21PCS d'ESD JEDEC Matrix résistante

Anti capteur noir corrosif de nano de JEDEC Tray Suppliers Cycle Loading For

Matériel PES ESD JEDEC Plateau de matrice Partie déformée Moins de 0,76 mm