Les nouvelles de l'entreprise sur Hiner-pack® Exhibiting at SEMICON China 2026 – Visit Us at Booth E6-6755

Hiner-pack® Exhibiting at SEMICON China 2026 – Visit Us at Booth E6-6755

2026-03-25

We are pleased to announce that Hiner-pack® is now exhibiting at SEMICON China 2026, taking place March 25–27, 2026 at the Shanghai New International Expo Centre.

SEMICON China is one of the most influential events in the global semiconductor industry, bringing together manufacturers, suppliers, and technology leaders to showcase innovations across wafer fabrication, semiconductor packaging, and electronic component handling.

At Booth E6-6755, Hiner-pack is presenting a comprehensive range of semiconductor packaging and handling solutions, including:

JEDEC Trays / IC Trays
Waffle Packs / Chip Trays / Bare Die Trays
Wafer Carriers and Wafer Shipping Boxes
Customized packaging solutions for semiconductor components

Our products are designed to deliver ESD protection, dimensional stability, and automation compatibility, helping improve safety and efficiency throughout semiconductor manufacturing, storage, and transportation processes.

Visitors are welcome to meet our team to:
Explore our latest packaging solutions
Discuss custom design requirements
Learn about material options for different temperature and cleanliness conditions

Discover reliable handling solutions for ICs, wafers, and electronic components

Exhibition Information
Event: SEMICON China 2026
Date: March 25–27, 2026
Venue: Shanghai New International Expo Centre, Shanghai, China
Booth: E6-6755

We look forward to meeting industry partners and customers during the exhibition.

dernières nouvelles de l'entreprise Hiner-pack® Exhibiting at SEMICON China 2026 – Visit Us at Booth E6-6755 0

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Bâtiment A11, Zone D, Zone Industrielle Ouest, Communauté de Minzhu, Rue Shajing, District de Baoan, Ville de Shenzhen, Province du GD, CN

Télégramme

86-0755-23229236-816

E-mail

Rainbowzhu@hiner-pack.com

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