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Deep Pocket JEDEC Tray for Large IC Modules with Reusable Design

Deep Pocket JEDEC Tray for Large IC Modules with Reusable Design

Nom De Marque: Hiner-pack
Numéro De Modèle: HN24225
Nombre De Pièces: 500 pièces
Prix: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Conditions De Paiement: T/T
Capacité à Fournir: 2000 pièces/jour
Informations détaillées
Lieu d'origine:
Chine
Certification:
ROHS, ISO
Tray Weight:
Varie, généralement jusqu'à 500 grammes par cavité
Couleur:
Généralement noir ou gris foncé pour la protection ESD
Assurance qualité:
Garantie de livraison, qualité fiable
Taille de la cavité:
48,5x45,5mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Type de moisissure:
Injection
Réutilisable:
Oui
Forme du plateau:
Rectangulaire
Classe propre:
Nettoyage général et ultrasonique
Type de circuit intégré:
Le nombre de points de contrôle est déterminé en fonction de l'échantillon.
Niveau d'emballage:
Forfait Transport
Platitude:
Moins de 0,76 mm
Capacité:
2x5 = 10 pièces
Détails d'emballage:
carton, palette
Capacité d'approvisionnement:
2000 pièces/jour
Mettre en évidence:

Deep Pocket JEDEC IC tray

,

Large IC module storage tray

,

JEDEC standard IC holder

Description du produit
Deep Pocket JEDEC Tray for Large IC Modules
Ideal for large or thick semiconductor devices, ensuring secure placement.
Key Features/ Benefits 
  • Deep cavity for large components
  • Strong structural support
  • Prevents damage during transport
  • Custom pocket design
Specifications
Brand Hiner-pack
Model  HN24225
Material  PPE
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×10.6 mm
Cavity Size 48.5x45.5 mm
Matrix QTY 2x5=10 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
JEDEC trays are widely used for IC protection during manufacturing and transport, especially for ESD-sensitive devices
  • Power modules
  • Industrial IC
  • Large semiconductor devices
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Automotive project experience
  • In-house mold design capability
  • Fast prototype development
  • Strict material control
  • Stable supply for global semiconductor customers